How can the wafer Kensington robot work best in certain functionality and the environment?

The techie leader in the semiconductor wafer handling automation products supports the 300 mm wafer handling.

You must know that the wafers present in the 300mm semiconductor fabrication facility are fetched via the Workshop I carriers that are known as front opening unified pods (FOUPs). The primary performance measure is recognized in the work in process (WIP) with the relevant cycle time. You know what would affect the models’ performance is the order arrival rate, average order size, batching policy, automated material handling systems, and the number of the batch tools.

At Kensington Laboratories, the techie leader in the semiconductor wafer handling automation products supports the 300 mm wafer handling Kensington robot. The ADO is proven in the volume manufacturing at the specific 300 mm production fabs and is supported by the global service and support network of the Kensington Laboratories.

The Kensington robot installation highlights:

1. Automated teaching
2. Fast installation without expertise
3. The robot interchangeability
4. The production scalability

Its built-in sensor identifies and measures the wafer. It also talks about the accuracy in the wafer position and boosts the system accuracy. The shaped LED beam integrates the end effector sensor and LED for reliability and safety.

The mapping identifies stacked wafer cassette errors and also detects cross-slotted wafer cassette errors. The wafer position elevation and the edge detection, shaped beam permits the measurements vs. presence/absence recognition. It measures both x and z wafer positions.

It virtually eradicates the backside contamination from the robot gripper. It provides minimal contact with the wafer edge. It is a controlled force for gripping wafers safely. You know its failsafe closed-loop design grips the wafer in the event of the power of vacuum loss.

It comprises of the following:

• Interoperability: It is fully congenial with the entire SEMI standard FOUPs.
• Cleanliness: It is better than Class1 particle performance when integrated into Class 100 or a better environment.
• Reliability: It consists of the robust design merged with the precision assembly that accomplishes the wholesome dependability and lifetime performance.
• Zero Preventive Maintenance: It consists of an excellent precision design that needs not at all periodic lubrication or re-alignment.
• Repeatability: It represents the industry-leading design that uses DSP controlled electrical mechanical/ pneumatic closed-loop servos for the précis repeatable motion.
• Wafer Mapping: The high performant break the beam wafer mapping option permits fast and accurate wafer detection.
• Customization: The configurable features involve the programming lights, buttons, carrier ID as well as AMHS options.
• Compliance: It holds up best with the compliance standards SEMI, S2, S8, CE, and F47 compliant.
• Bridge tool: It comprises of 200mm wafer operation with having an insert of 10mm pitch.

Now, let us talk about its additional features:

• The carrier ID R/W at the dock as well as undocked.
• It gives the twist and [pull FOUP door attach.
• It also consists of a twist and pulls center lock FOUP clamp.
• It also has servo control/force feedback motion technology.
• The FEOL and BEOL lockout pins.
• It has five FOUP placement sensors.
• The programmable AMHS drop off positions.
• It has a finger-safe motion control safety circuit.
• It consists of flash firmware up-loadable.
• It has integrated self-test diagnostics.
• It is configured status lights.

You can choose from the options:

• Barcode
• Mobility Stand
• Wafer Mapper
• Break-The Beam type
• Info Pad sensors
• Quartz wafer profusion sensors
• E diagnostics
• Load/Unload Manual buttons
• Carrier ID R/W interface
• RFID AdvanTag, HERMOSO, Omron
• IRID Smart Tag
• 200mm Bridge Tool (with an insert at 10mm pitch)
• E diagnostics with GUI
• AMHS Single and Dual E64 PIO for OHT as well as AGV/RGV

One can have the automatic door opener (ADO), 300mm load port are designed for the stringent wafer isolation and the fab requirements. The 300mm edge-grip reduces particle performance and via beam technology for the wafer mapping.

Consult our team to have more knowledge on the Kensington robot.

Source: Free Guest Posting Articles from ArticlesFactory.com